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512K/256K x36 SYNCHRONOUS DUAL QDR-IITM
(R)
PRELIMINARY DATASHET IDT70P3537 IDT70P3517
Features

18Mb Density (512K x 36) - Also available 9Mb Density (256K x 36) QDR-II x 36 Burst-of-2 Interface - Commercial: 233MHz, 250MHz Two independent ports - True Dual-Port Access to common memory Separate, Independent Read and Write Data Buses on each Port - Supports concurrent transactions Two-Word Burst on all DPRAM accesses DDR (Double Data Rate) Multiplexed Address Bus - One Read and One Write request per clock cycle DDR (Double Data Rate) Data Buses - Four word burst data (Two Read and Two Write) per clock on

each port - Four word transfers each of Read & Write per clock cycle per port (four word bursts on 2 ports) Octal Data Rate Port Enable pins (E0,E1) for depth expansion Dual Echo Clock Output with DLL-based phase alignment High Speed Transceiver Logic inputs - scaled to receive signals from 1.4V to 1.9V Scalable output drivers - Drives HSTL, 1.8V TTL or any voltage level from 1.4V to 1.9V - Output impedance adjustable from 35 ohms to 70 ohms 1.8V Core Voltage (VDD) 576-ball Flip Chip BGA (25mm x 25mm, 1.0mm ball pitch) JTAG Interface - IEEE 1149.1 Compliant
Functional Block Diagram
VREFL EP[1:0] EL[1:0]
WRITE REGISTER WRITE REGISTER
VREFR
ER[1:0]
D0 L - D3 5 L KL KL
LEFT PORT DATA REGISTER AND LOGIC
KL ZQL (1) Q0 L - Q3 5 L CQL, CQL
WRITE DRIVER
RIGHT PORT DATA REGISTER AND LOGIC
KR
SELECT OUTPUT
D0 R - D3 5 R KR KR
OUTPUT REGISTER
OUTPUT REGISTER
OUTPUT BUFFER
OUTPUT BUFFER
SELECT OUTPUT
SENSE AMPS
SENSE AMPS
ZQR (1) Q0 R - Q3 5 R CQR, CQR
MUX
KL CL
MUX
512/256K x 36 MEMORY ARRAY
KR CR
A0L- A17L(2) RL WL BW0 L - BW3 L KL KL
LEFT PORT ADDRESS REGISTER AND LOGIC
OR
CL, CL KL, KL
OR
CR, CR KR, KR
ADDRESS DECODE
RIGHT PORT ADDRESS REGISTER AND LOGIC
A0R- A17R(2) RR WR BW0 R - BW3 R KR KR
TDI VREFL TDO
JTAG
TCK TMS TRST
5677 drw01
VREFR
NOTES: 1. Input pin to adjust the device outputs to the system data bus impedance. 2. Address A17 is a INC for IDT70P3517. Disabled input pin (Diode tied to VDD and VSS).
July 16, 2007
(c)2007 Integrated Device Technology, Inc. All rights reserved. Advanced Datasheet for informational purposes only. Product specifications subject to change without notice. NOT AN OFFER FOR SALE The information presented herein is subject to a Non-Disclosure Agreement (NDA) and is for planning purposes only. Nothing contained in this presentation, whether verbal or written, is intended as, or shall have the effect of, a sale or an offer for sale that creates a contractual power of acceptance. "QDR SRAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress Semicondor, IDT, and Micron Tecnology, Inc." DSC-5677/1
18/9Mb x36 IDT70P3537/70P3517 SYNCHRONOUS Dual QDR-IITM
Preliminary Datasheet Commercial Temperatue Range
Pin Configuration
70P3537 70P3517 RM-576 Ball Flip Chip BGA Top View
A1 BALL PAD CORNER
1 A
VSS
2
VSS D17R
3
ZQR VSS
4
VSS
5
6
7
8
A3R A4R A1R VSS VDDQR VSS VDDQR
9
RR A5R A6R VDDQR VSS VDD VSS
10
BW0R BW1R A7R VSS VDD VSS VDD
11
E0R E1R KR VDDQR VSS VDD VSS
12
VDD VSS KR VSS VDD VSS VDD
13
VREFR VDD CR VSS VDD VSS VDD
14
BW3R BW2R CR VDDQR VSS VDD VSS
15
A8R WR A10R VSS VDD VSS VDD
16
A9R A12R A11R VDDQR VSS VDD VSS
17
A14R A13R A16R VSS VDDQR VSS VDDQR
18
A15R INC A17R VDDQR VSS VDDQR VSS
19
VDDQR VSS
20
VSS VSS
21
22
23
VSS
24 A
VSS
VSS VDDQR A2R VSS
EP0
MRST DOFFR VSS Q35R Q33R Q31R Q29R Q27R
B
VSS VDDQR DEPTH VDDQR D35R VSS D33R VSS
B C
D16R D15R VDDQR Q17R D13R VSS Q15R VSS VDDQR Q16R A0R VDDQR VDDQR VSS VDDQR VSS VDDQR Q34R Q32R Q30R Q28R CQR Q25R Q23R Q21R Q19R Q34L Q32L Q30L D34R
C D
D14R VSS VDDQR VDDQR D31R VSS D29R D32R
D E
D12R D11R VDDQR Q13R D10R VSS VSS VDDQR Q11R Q9R Q14R VDDQR VSS Q12R VSS VDDQR D30R
E F
VSS VDDQR D27R VSS D26R D28R
F G
VREFR Q10R VDDQR VSS VSS
G H
D9R D8R VSS Q8R Q6R Q4R Q2R Q0R Q17L Q15L Q13L CQR VSS VDDQR VSS VSS VDDQR VSS VDDQR VDD VSS VDD VSS VDD VSS VDD VSS VSS VDD VSS VDD VDD VSS VDD VSS VDD VSS VDD VSS VSS VDD VSS VDD VSS VDD VSS VDD VSS VDD VSS VDD VSS VDD VSS VDD VDD VSS VDD VSS VDD VSS VDD VSS VSS VDD VSS VDD VSS VDD VSS VDD VDD VSS VDD VSS VDD VSS VDD VSS VSS VDDQR VSS VDDQR VSS VDDQL VSS VDDQL VDDQR VSS VDDQR VSS VDDQR VSS VDDQL VSS VSS VDDQR VSS VDDQR VSS VDDQL VSS VDDQL Q26R Q24R Q22R Q20R Q18R Q35L Q33L Q31L VDDQR VSS VSS D24R VREFR
H J
D7R D6R VDDQR D4R VSS Q7R VDDQR Q5R D25R
J K
D5R VSS VDDQR VSS VDDQR D22R VSS D20R D23R
K L
D3R D2R VDDQR D0R Q3R VDDQR Q1R D21R
L M
D1R VSS VSS VDDQR VSS VDDQL VSS VDDQL VSS VDDQL VSS VDD VSS VDD VDDQR D18R VSS D35L D19R
M N
D16L D17L VDDQL D15L VSS Q16L VDDQL Q14L VSS D34L
N P
D14L VDDQL D33L VSS D31L D32L
P R
D12L D13L VDDQL Q12L VDDQL VSS VDDQL VSS VDDQL D30L
R T
D10L D11L VSS D9L D8L D6L D4L D2L D0L VSS VSS VDDQL VSS VDDQL VSS VDDQL VSS VDDQL ZQL Q11L Q9L Q8L Q6L Q4L Q2L Q0L VSS VSS Q10L VSS VSS VDDQL VSS VDDQL VSS VDDQL A1L A4L A3L VDD VSS VDD VSS VDD VSS VDD VSS VDD VSS VDD VSS VDD VSS VDD VSS VSS KL VDD VREFL VSS VDD VSS VDD VSS VSS CL VDD VSS VDD VSS VDD VSS VDD VSS VDD VSS VDD VSS VDDQL VSS VDDQL VSS VDDQL VSS VDDQL VSS Q28L CQL Q25L Q23L Q21L Q19L VDDQL VSS TRST Q29L Q27L Q26L Q24L Q22L Q20L Q18L VDDQL TCK VDDQL D29L VSS VDDQL D27L VSS D25L D28L
T U
VREFL CQL VDDQL Q7L Q5L Q3L VSS D26L
U V
VSS VREFL
V W
D7L VDDQL VSS VSS VDDQL VSS A0L VSS VDD VSS A6L A5L RL VSS VDD VSS VDD VSS VDD VSS A11L A12L A9L VDDQL VSS VDDQL A16L A13L A14L VSS VDDQL VSS A17L INC A15L VDDQL VSS VDDQL VSS VDDQL VSS VSS VSS
W Y
D5L VDDQL D24L VSS D22L D23L
Y AA
D3L Q1L VDDQL VDDQL VSS TDI TMS VDDQL VDDQL A7L BW1L BW0L KL E1L E0L VDDQL VDDQL CL BW2L BW3L A10L WL A8L D21L
AA AB
D1L
AB
VDDQL D20L DOFFL D18L TDO VSS D19L
AC
VSS VDDQL EP1 VSS A2L VSS VDD VSS
AC AD
VSS VSS
AD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
5677 drw
NOTE: 1. The package is 25mm x 25mm x 2.55mm with 1.0mm ball pitch; the customer will have to provide external airflow of 100LFM (0.5m/s) or higher at 250MHz.
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July 16, 2007
18/9Mb x36 IDT70P3537/70P3517 SYNCHRONOUS Dual QDR-IITM
Preliminary Datasheet Commercial Temperatue Range
Functional Description
As a memory standard, the (Quad Data Rate) QDR-II SRAM interface has become increasingly common in high performance networking systems. With the QDR-II interface/configuration, memory throughput is increased without increasing the clock rate via the use of two unidirectional buses on each of providing 2 ports of QDR-II makes this a Dual-QDRII Static Ram two ports to transfer data without the need for bus turnaround. Dual QDR-II Static RAMs are high speed synchronous memories supporting two independent double-data-rate (DDR) read and write data ports. This scheme allows simultaneous read and write access for the maximum device throughput - two data items are passed with each read or write. Four data word transfers occur per clock cycle, providing quad-data-rate (QDR) performance on each port. Comparing this with standard SRAM common I/O single data rate (SDR) devices, a four to one increase in data access is achieved at equivalent clock speeds. IDT70P3537/70P3517 Dual QDR-II Static RAM devices, are capable of sustaining full bandwidth on both the input and output buses simultaneously. Using independent buses for read and write data access simplifies design by eliminating the need for bidirectional buses. And all data are in two word bursts, (with addressing capability to the burst level). Devices with QDR-II interfaces include network processor units (NPUs) and field programmable gate arrays (FPGAs). IDT70P3537/70P3517 Dual QDR-II Static RAMs support unidirectional 36-bit read and write interfaces. These data inputs and outputs operate simultaneously, thus eliminating the need for highspeed bus turnarounds (i.e. no dead cycles are present). Access to each port is accomplished using a common 18-bit address bus (17 bits for IDT70P3517). Addresses for reads and writes are latched on rising edges of the K and K input clocks, respectively.The K and K clocks are offset by 90 degrees or half a clock cycle. Each address location is associated with two 36-bit data words that burst sequentially into or out of the device. Since data can be transferred into and out of the device on every rising edge of the K and K clocks, memory bandwidth is maximized while simplifying overall design through the elimination of bus turnaround(s). IDT70P3537/70P3517 Dual QDR-II Static RAMs can support devices in a multi-drop configuration (i.e. multiple devices connected to the same interface). Through this capability, system designers can support compatible devices such as NPUs and FPGAs on the same bus at the same time. Using independent ports for read and write access simplifies design by eliminating the need for bidirectional buses. All buses associated with Dual QDR-II Static RAMs are unidirectional and can be optimized for signal integrity at very high bus speeds. The Dual QDR-II Static RAM has scalable output impedance on its data output bus and echo clocks allowing the user to tune the bus for low noise and high performance. IDT70P3537/70P3517 Dual QDR-II Static RAMs have a single DDR address bus per port with multiplexed read and write addresses. All read addresses are received on the first half of the clock cycle and all write addresses are received on the second half of the clock cycle. The byte write signals are received on both halves of the clock cycle simultaneously with the data they are controlling on the data input bus. The Dual QDR-II Static RAM device has echo clocks, which provide the user with a clock that is precisely timed to the data output
3
and tuned with matching impedance and signal quality. The user can use the echo clock for downstream clocking of the data. For the user, echo clocks eliminate the need to produce alternate clocks with precise timing, positioning, and signal qualities to guarantee data capture. Since the echo clocks are generated by the same source that drives the data output, the relationship to the data is NOT significantly affected by external parameters such as voltage, temperature, and process as would be the case if the clock were generated by an outside source.Thus the echo clocks are guaranteed to be synchronized with the data. All interfaces of Dual QDR-II Static RAMs are HSTL, allowing speeds beyond SRAM devices that use any form of TTL interface. The interface can be scaled to higher voltages (up to 1.9V) to interface with 1.8V systems, if necessary. The device has VDDQ pins and a separate Vref, allowing the user to designate the interface operational voltage independent of the device core voltage of 1.8V VDD. Output impedance control pins allow the user to adjust the drive strength to adapt to a wide range of loads and transmission lines. Clocking The IDT70P3537/3517 has two sets of input clocks for both the input and output, the K, K clocks and the C, C clocks. In addition, the IDT70P3537/3517 has an output "echo" clock pair, CQ and CQ. The K and K clocks are the primary device input clocks. The K clock is used to clock in the control signals (R, W, E[1:0], BW0-3), the read address, and the first word of the data burst (D[35:0]) during a write operation. The K clock is used to clock in the control signals (BW0-3, E[1:0]), write address and the second word of the data burst during a write operation (D[35:0]). In the event that the user disables the C and C clocks, the K and K clocks will also be used to clock the data out of the output register and generate the echo clocks. The K and K, C and C,CQ and CQ, pairs are offset by half a clock cycle from each other. The C and C clocks may be used to clock the data out of the output register during read operations and to generate the echo clocks. C and C must be presented to the memory within the timing tolerances as shown in the AC Electrical Characteristics Table (Page 12). The output data from the IDT70P3537/70P3517 will be closely aligned to the C and C input, through the use of an internal DLL. When C is presented to the IDT70P3537/70P3517 the DLL will have already internally clocked the data to arrive at the device output simultaneously with the arrival of the C clock. The C and second data item of the burst will also correspond. Single Clock Mode The IDT70P3537/70P3517 may be operated with a single clock pair. C and C may be disabled by tying both signals high, forcing the outputs and echo clocks to be controlled instead by the K and K clocks. DLL Operation The DLL in the output structure of the IDT70P3537/70P3517 can be used to closely align the incoming clocks C and C with the output of the data, generating very tight tolerances between the
July 16, 2007
18/9Mb x36 IDT70P3537/70P3517 SYNCHRONOUS Dual QDR-IITM
Preliminary Datasheet Commercial Temperatue Range
two. The user may disable the DLL by holding DOFF low. With the DLL off, the C and C (or K and K, if C and C are not used) will directly clock the output register of the IDT70P3537/70P3517. With the DLL off, there will be a propagation delay from the time the clock enters the device until the data appears at the output. QDR-II becomes QDRITM with DLL off. First data out is referenced to C instead of C. Echo Clock The echo clocks, CQ and CQ, are generated by the C and C clocks (or K, K if C, C are disabled). The rising edge of C generates the rising edge of CQ, and the falling edge of CQ. The rising edge of C generates the rising edge of CQ and the falling edge of CQ. This scheme improves the correlation of the rising and falling edges of the echo clock and will improve the duty cycle of the individual signals. The echo clock is very closely aligned with the data, guaranteeing that the echo clock will remain closely correlated with the data, within the tolerances designated. Normal QDR-II Read and Write Operations The IDT70P3537/70P3517 Dual QDR-II Static RAM supports QDR-II burst-of-two read/write operations. Read operations are initiated by holding the read port select (R) low, and presenting the read address to the address port during the rising edge of K which will latch the address. Data is delivered after the next rising edge of the next K (t + 1), using C and C as the output timing references; or K and K, if C and C are tied high. The write operation is a standard QDR-II burst-of-two write operation, except the data is not available to be read until the next clock cycle (this is one cycle later than standard QDR-II SRAM).
Normal QDR write cycles are initiated by holding the write port select (W) low at K rising edge. Also, the Byte Write inputs (BW0-3), designating which bytes are to be written, need to be held low for both the K and K clocks. On the rising edge of K the first word of the data must also be present on the data input bus D[35:0] observing the designated set up times. Upon the rising edge of K the first word of the burst will be latched into the input register. After K has risen, and the designated hold times observed, the second half of the clock cycle is initiated by presenting the write address to the address bus A[X:0], the BW0-3 inputs for the second data word of the burst, and the second data item of the burst to the data bus D[35:0]. Upon the rising edge of K, the second word of the burst will be latched, along with the designated address. Both the first and second words of the burst will be written into memory as designated by the address and byte write enables. The addresses for the write cycles is provided at the K rising edge, and data is expected at the rising edge of K and K, beginning at the same K that initiated the cycle. Programmable Impedance An external resistor, RQ, must be connected between the ZQ pin on the IDT70P3537/70P3517 and tied to VSS to allow the IDT70P3537/70P3517 to adjust its output drive impedance. The value of RQ must be 5X the value of the intended drive impedance of the IDT70P3537/70P3517. The allowable range of RQ to guarantee impedance matching with a tolerance of +/- 15% is 175 ohms to 350 ohms. The output impedance is adjusted every 1024 clock cycles to correct for drifts in supply voltage and temperature. If the user wishes to drive the output impedance of the IDT70P3537/70P3517 to its lowest value, the ZQ pin may be tied to VDDQ.
4
July 16, 2007
18/9Mb x36 IDT70P3537/70P3517 SYNCHRONOUS Dual QDR-IITM
Preliminary Datasheet Commercial Temperatue Range
Pin Definitions
Symbol(1) D[35:0]X Pin Function Input Synchronous Input Synchronous Input Synchronous Output Synchronous Input Synchronous Input Synchronous Input Clock Input Clock Input Clock Input Clock Output Clock Description Data input signals, sampled on the rising edge of K and K clocks during valid write operations Byte Write Selects active LOW. Sampled on the rising edge of the K and again on the rising edge of K clocks during write operations. Used to select which byte is written into the device during the current portion of the write operations. Bytes not written remain unaltered. All byte writes are sampled on the same edge as the data. Deselecting a Byte Write Select will cause the corresponding byte of data to be ignored and not written in to the device. BW0 controls D[8:0], BW1 controls D[17:9], BW2 controls D[26:18], and BW3 controls D[35:27]. Address Inputs. Read addresses are sampled on the rising edge of K clock during active read operations. Write addresses are sampled on the rising edge of K clock during active write operations. These address inputs are multiplxed, so that both a read and write operation can occur on the same clock cycle. These inputs are ignored when the appropriate port is deselected. Data Output signals. These pins drive out the requested data during a Read operation. Valid data is driven out on the rising edge of both the C and C clocks during Read operations or K and K when operating in single clock mode. When the Read port is deselected, Q[35:0] are automatically tri-stated. Write Control Logic, active LOW. Sampled on the rising edge of the positive input clock (K). When asserted active, a write operation in initiated. Deasserting will deselect the Write port. Deselecting the Write port will cause D[35:0] to be ignored. Read Control Logic, active LOW. Sampled on the rising edge of Positive Input Clock (K). When active, a Read operation is initiated. Deasserting will cause the Read port to be deselected. When deselected, the pending access is allowed to complete and the output drivers are automatically tri-stated following the next rising edge of the C clock. (DOFFX = 1). Each read access consists of a burst of two sequential transfers. Positive Output Clock Input. C is used in conjunction with C to clock out the Read data from the device. C and C can be used together to deskew the flight times of various devices on the board back to the controller. See application example for further details. Negative Output Clock Input. C is used in conjunction with C to clock out the Read data from the device. C and C can be used together to deskew the flight times of various devices on the board back to the controller. See application example for further details. Positive Input Clock Input. The rising edge of K is used to capture synchronous inputs to the device. Drives out data through Q[35:0] when in single clock mode. All accesses are initiated on the rising edge of K. Negative Input Clock Input. K is used to capture synchronous inputs being presented to the device. Drives out data through Q[35:0] when in single clock mode. Synchronous Echo clock output. The rising edge of CQ is tightly matched to the synchronous data outputs and can be used as a data valid indication. CQ is free running and does not stop when the output data is tri-stated. Synchronous Echo Clock output. The rising edge of CQ is tightly matched to the synchronous data outputs and can be used as a data valid indication. CQ is free running and does not stop wehen the output data is tri-stated. Output Impedance Matching Input. This input is used to tune the device outputs to the system data bus impedance. Q[35:0] output impedance is set to 0.2 x RQ, where RQ is a resistor connected between ZQ and ground. Alternately, this pin can be connected directly to V DDQ, which enables the minimum impedance mode. This pin cannot be connected directly to GND or left unconnected. EP[1:0] are used to program the Port Enable pins E[1:0]. EP[1:0] are programmed by tying the pins high or low on the board. If a customer does not want to use Pins EP[1:0], then these pins should be tied low. Refer to Truth Table III for Port Enable pins. Two Port Enable pins E[1:0] are provided to connect to the two MSB bits on the memory controller in order to cascade up to four IDT70P3537 devices. If a customer does not want to use Pins E[1:0], then these pins should be tied low. Refer to Truth Table III for Port Enable pins. Also refer to Figure 1 showing cascade/multi-drop using port-enable (E[1:0]) pins. E[1:0] are sampled on the rising edge of K for read operations and again on rising edge of K for write operations. DLL Turn Off. When low this input will turn off the DLL inside the device. The AC timings with the DLL turned off will be different from those listed in this data sheet. There will be an increased propagation delay from the incidence of C and C to Q, or K and K to Q as configured.
BW0X, BW1X, BW2X, BW3X
A[17:0]X(2)
Q[35:0]X WX
RX
CX CX KX KX CQX
CQX ZQX
Output Clock Input
EP[1:0] EX[1:0]
Input Input Syncronous
DOFFX MRST DEPTH TDO TCK TDI TMS TRST INC VREFX VDD VSS VDDQX
Input
Input Master Reset pin. When held low will reset the device. Asynchronous Input Output Input Input Input Connect to VDDQ for 9Mb. Connect to VSS for 18Mb. TDO pin for JTAG. TCK pin for JTAG. TDI pin for JTAG. TMS pin for JTAG.
Input Reset pin for JTAG. Asynchronous Should be tied to VCC or VSS only, or can be left as a floating pin. Input Reference Reference Voltage input. Static input used to set the reference level for HSTL inputs as well as AC measurement points.
Power Supply Power supply inputs to the core of the device. Should be connected to a 1.8V power supply. Ground Ground for the device. Should be connected to ground of the system.
Power Supply Power supply for the outputs of the device. Should be connected to a 1.5V power supply for HSTL or scaled to the desired output voltage.
5677 tbl 01
NOTE: 1. "X" = "L" for the Left Port pins and "X" = "R" for the Right Port pins. 2. A[16:0]x for IDT70P3517.
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July 16, 2007
18/9Mb x36 IDT70P3537/70P3517 SYNCHRONOUS Dual QDR-IITM
Preliminary Datasheet Commercial Temperatue Range
Truth Table I - Synchronous Port Control(1)
D(3,4) K Stopped Stopped H H K R X W X EO(2) E1(2) X X X X X X F F X X X X L X T X X L X T X X X X X X F F T X X T DIN at K(t) DIN at K(t) X X X X X X DOUT at C (t+1) X X High - Z High - Z X X High - Z High - Z D(A+0) X X D(A+1) C Stopped Stopped High - Z High - Z C Q(A+0) Previous state Q(3,4) Q(A+1) OPERATION Clock stopped Previous state Clock stopped No operation No operation No operation No operation No operation No operation Read DOUT at C (t+2) Read Write Write
5677 tbl 03
NOTES: represents rising edge. 1. x = "Don't Care", H = Logic High, L = Logic Low, 2. T (True) = E and EP have some polarity (device selected) on the rising edge of the appropriate clock. F (False) =E and EP have opposite polarity (device de-selected) on the rising edge of the appropriate clock. See Truth Table III. 3. "A" represents address location latched by the device when operation was initiated. A+0, A+1 represents the internal address sequence in the burst. 4. "t" represents the cycle at which a read/write operation is started. t+1 and t+2 are the first and second clock cycles respectively following clock cycle t.
Truth Table II - Write Port Enable Control(2,3)
K Input K Input BW0(1) Input H H L L H H H H H H L L BW1(1) Input H H H H L L H H H H L L BW2(1) Input H H H H H H L L H H L L BW3(1) Input H H H H H H H H L L L L Write function disabled all bytes Write function disabled all bytes Write data inputs to Byte 0 Only Write data inputs to Byte 0 Only Write data inputs to Byte 1 Only Write data inputs to Byte 1 Only Write data inputs to Byte 2 Only Write data inputs to Byte 2 Only Write data inputs to Byte 3 Only Write data inputs to Byte 3 Only Write data inputs to all Bytes Write data inputs to all Bytes
5677 tbl 03a
Mode
NOTES: 1. BW0 controls D[8:0], BW1 controls D[17:9], BW2 controls D[26:18], BW3 controls D[35:27]. 2. For this table: W is Low on the rising edge of K; E0 and E1 are true on the rising edge of K. See Truth Tables I and III. Addresses for Writes are qualified on rising edge of K. 3. This table represents a subset of the potential write scenarios based upon BW0 - BW3 inputs and is meant to illustrate basic device functionality.
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July 16, 2007
18/9Mb x36 IDT70P3537/70P3517 SYNCHRONOUS Dual QDR-IITM
Preliminary Datasheet Commercial Temperatue Range
Truth Table III - Port Enable Pins(1) Normal Read and Writes
Device Selected Bank 0 Bank 1 Bank 2 Bank 3 EP[0] VSS VDD VSS VDD EP[1] VSS VSS VDD VDD E[0] L H L H E[1] L L H H
5677 tbl05
NOTES: 1. EP [1:0] - Port Enable Programming Polarity (see pin description for the entire device). 2. Ex[1:0] - Port Enable (see pin description assigned for each port).
Cascade/Multi-Drop using Port Enable (E0 & E1) Pins
As shown below in Figure 1 upto four devices can be cascaded using the Port Enable (E0,E1) pins scheme. The port enable pins are subject to the same DC characteristics as the QDR interface. Refer to Pin Definitions table for pin descriptions. This diagram illustrates one port of a QDR-II dual port
Figure 1. Multi-drop Cascading using the Chip Enable E[1:0] Pins
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July 16, 2007
18/9Mb x36 IDT70P3537/70P3517 SYNCHRONOUS Dual QDR-IITM
Preliminary Datasheet Commercial Temperatue Range
Absolute Maximum Ratings(1,2,3)
Symbol VDD VDDQ VTERM TBIAS TSTG IOUT Rating Supply Voltage on VDD with Respect to GND Supply Voltage on VDDQ with Respect to GND Voltage on Input, Output and I/O terminals with respect to GND Temperature Under Bias Storage Temperature Continuous Current into Outputs Value -0.5 to +2.2 -0.5 to VDD -0.3 to VDD+0.3 -55 to +125 -65 to +150 + 20 Unit V V V C C mA
5677 tbl 07
Capacitance
Symbol CIN CO
(TA = +25C, f = 1.0MHz)(1)
Conditions(2) VIN = 0V VOUT = 0V Max. 5 7 Unit pF pF
5677 tbl 08
Parameter Input Capacitance Output Capacitance
NOTE: 1. Tested at characterization and retested after any design or process change that may affect these parameters. 2. VDD = 1.8V, VDDQ = 1.5V
NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VDDQ must not exceed VDD during normal operation. 3. VTerm(MAX) = minimum of VDD +0.3V and 2.2V.
Recommended DC Operating and Temperature Conditions
Symbol VDD VDDQ VSS Parameter Power Supply Voltage I/O Supply Voltage Ground Input Reference Voltage Input High Voltage Input Low Voltage Ambient Temperature (1) Min. 1.7 1.4 0 0.68 VREF+0.1 -0.3 0 Typ. 1.8 1.5 0 VDDQ/2 - - 25 Max. 1.9 1.9 0 0.95 VDDQ+0.3 VREF-0.1 +70 Unit V V V V V V
o
Thermal Resistance
Parameter Junction to Ambient Junction to Case Symbol
JA JC
VREF VIH
Typ. 12.5 0.1
Unit C/W C/W
5677 tbl 10
VIL TA
c
5677 tbl 09
NOTE: 1. Junction temperature is a function of on-chip power dissipation, package thermal impedance, mounting site temperature and mounting site thermal impedance. TJ = TA + PD x JA.
NOTE: 1. During production testing, the case temperature equals the ambient temperature.
Recommended Operating Temperature and Supply Voltage
Grade Commercial Industrial Ambient Temperature 0OC to +70OC -40OC to +85OC GND 0V 0V VDD 1.8V + 100mV 1.8V + 100mV
5677 tbl06
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DC Electrical Characteristics Over the Operating Temperature and Supply Voltage (VDD = 1.8V 100mV, VDDQ = 1.4V to 1.9V, TA = 0 to 70C)
Parameter Input Leakage Current Output Leakage Current Symbol IIL IOL IDD Test Conditions VDD = Max VIN = VSS to VDDQ Output Disabled VDD = Max, IOUT = 0mA (outputs open), Cycle Time > tKHKH Min VDD = Max, IOUT = 0mA (outputs open), Cycle Time > tKHKH Min VDD = Max, IOUT = 0mA (outputs open), Cycle Time > tKHKH Min Device Deselected IOUT = 0mA (outputs open), f=Max, All Inputs < 0.2V or > VDD - 0.2V WEN=REN=High ZQ = 250, IOH = -(VDDQ/2)/(RQ/5) ZQ = 250, IOL = (VDDQ/2)/(RQ/5) IOH = -0.1mA IOL = 0.1mA VOUT = VDDQ/2 VOUT = VDDQ/2 250MHZ 233MHZ 250MHZ 233MHZ 250MHZ 233MHZ 250MHZ 233MHZ Min -10 -10 VDDQ/2 -0.12 VDDQ/2 -0.12 VDDQ -0.2 VSS -(IOHo-15%) (IOLo-15%) Max +10 +10 1636 1542 1432 1351 1212 1147 1007 956 VDDQ/2 +0.12 VDDQ/2 +0.12 VDDQ 0.2 -(IOHo+15%) (IOLo+15%) mA 2 mA 1 mA 1 mA 1 Unit A A Note 8 8
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Preliminary Datasheet Commercial Temperatue Range
Active Operating Current
2 Port Read
IDD1
2 Port Write
IDD2
Standby Current
ISB
Output High Voltage Output Low Voltage Output High Voltage Output Low Voltage Output Impedance Control
VOH1 VOL1 VOH2 VOL2 | IOH | | IOL |
V V V V V
3,7 4,7 5 6 3 4
5677 tbl12
NOTES: 1. Operating Current is measured at 100% bus utilization on the active port. 2. Standby Current is only after all pending read and write burst operations are completed. 3. Outputs are impedance-controlled. IOHO = (VDDQ/2)/(RQ/5) = @Vout = VDDQ/2 and is guaranteed by device characterization for 175 < ZQ < 350. This parameter is tes at ZQ = 250, which gives a nominal 50 output impedance. 4. Outputs are impedance-controlled. IOLO = (VDDQ/2)/(RQ/5) = @Vout = VDDQ/2 and is guaranteed by device characterization for 175 < ZQ < 350. This parameter is tes at ZQ = 250, which gives a nominal 50 output impedance. 5. This measurement is taken to ensure that the output has the capability of pullling to the VDDQ rail, and is not intended to be used as an impedance measurement point. 6. This measurement is taken to ensure that the output has the capability of pulling to VSS, and is not intended to be used as an impedance measure point. 7. Programmable Impedance Mode. 8. 30A for JTAG input pins.
Input Electrical Characteristics Over the Operating Temperature and Supply Voltage (VDD = 1.8V 100mV, VDDQ = 1.4V to 1.9V, TA = 0 to 70C)
Parameter Input High Voltage, DC Input Low Voltage, DC Input High Voltage, AC Input Low Voltage, AC
NOTES: 1. These are DC test criteria. DC design criteria is VREF + 50mV. The AC VIH/VIL levels are defined separately for measuring timing parameters. 2. VIH (Max) DC = VDDQ +0.3V, VIH (Max) AC = VDDQ +0.5V (pulse width < 20% tKHKH (min)). 3. VIL (MIN) DC = -0.3V, VIL (MIN) AC = -0.5V (pulse width < 20% tKHKH (min)). 4. This condition is for AC function test only, not for AC parameter test. 5. To maintain a valid level, the transitioning edge of the input must: Sustain a constant slew rate from the current AC level through the target AC level, VIL (AC) or VIH (AC) Reach at least the target AC level After the AC target level is reached, continue to maintain at least the target DC level, VIL (DC) or VIH (DC)
Symbol VIH (DC) VIL (DC) VIH (AC) VIL (AC)
Min VREF +0.1 -0.3 VREF +0.2 -
Max VDDQ +0.3 VREF -0.1 VREF -0.2
Unit V V V V
Notes 1,2 1,3 4,5 4,5
5677 tbl 13
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Overshoot Timing
Undershoot Timing
VIL
VSS VSS -0.25V VSS -0.5V
20%
tKHKH (MIN)
5677 drw 06
AC Test Loads
VREF OUTPUT Device Under Test ZQ Z0 = 50 RQ = 250 VDDQ/2 RL = 50 VDDQ/2
AC Test Conditions
Parameter Core Power Supply Voltage Output Power Supply Voltage Input High Level Input Low Level Input Reference Level Input Rise/Fall Time
5677 drw 07
Symbol VDD VDDQ VIH VIL VREF TR/TF
Value 1.7-1.9 1.4-1.9 (VDDQ/2) +0.5 (VDDQ/2) -0.5 VDDQ/2 0.3/0.3 VDDQ/2
Unit V V V V V ns V
5677 tbl 14
Output Timing Reference Level
NOTE: 1. Parameters are tested with RQ=250.
(VDDQ/2) +0.5V VDDQ/2 (VDDQ/2) -0.5V
5677 drw08
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AC Electrical Characteristics
(VDD = 1.8V 100mV, VDDQ = 1.4V to 1.9V, TA(8) = 0 to 70C)
Commercial 250MHz Symbol Clock Parameters tKHKH tKC var tKHKL tKLKH tKHKH tKHKH tKHCH tKC lock tKC reset Average clock cycle time (K,K,C,C) Clock Phase Jitter (K,K,C,C) Clock High Time (K,K,C,C) Clock LOW Time (K,K,C,C) Clock to clock (KK,CC) Clock to clock (KK,CC) Clock to data clock (KC,KC) DLL lock time (K, C) K static to DLL reset 4.00
__
Com'l & Ind'l 233MHz
Parameter
Min.
Max.
Min.
Max.
Unit
Notes
6.30 0.20
__
4.30
__
7.20 0.20
__
ns ns ns ns ns ns ns cycles ns 2 1,5 9 9 10 10
1.60 1.60 1.80 1.80 0.00 1024 30
1.80 1.80 2.00 2.00 0.00 1024 30
__
__
__
__
__
__
1.80
__
2.00
__
__
__
Output Parameters tCHQV tCHQX tCHCQV tCHCQX tCQHQV tCQHQX tCHQZ tCHQX1 C,C HIGH to output valid C,C HIGH to output hold C,C HIGH to echo clock valid C,C HIGH to echo clock hold CQ,CQ HIGH to output valid CQ,CQ HIGH to output hold C HIGH to output High-Z C HIGH to output Low-Z
__
0.45
__
__
0.45
__
ns ns ns ns ns ns ns ns
3 3 3 3
-0.45
__
-0.45
__
0.45
__
0.45
__
-0.45
__
-0.45
__
0.30
__
0.32
__
-0.30
__
-0.32
__
0.45
__
0.45
__
3,4,5 3,4,5
-0.45
-0.45
Set-Up Times tAVKH tIVKH tDVKH Address valid to K,K rising edge Control inputs valid to K,K rising edge Date-in valid to K, K rising edge 0.35 0.35 0.35
__
0.37 0.37 0.37
__
ns ns ns
6 7
__
__
__
__
Hold Times tKHAX tKHIX tKHDX K,K rising edge to address hold K,K rising edge to control inputs hold K,K rising edge to data-in hold 0.35 0.35 0.35
__
0.37 0.37 0.37
__
ns ns ns
6 7
__
__
__
__
Port-to-Port Delay tCO Clock-to-Clock Offset 4.00
--
4.30
--
ns
6725 tbl15
NOTES: 1. Cycle to cycle period jitter is the variance from clock rising edge to the next expected clock rising edge, as defined per JEDEC Standard No. 65 (EIA/JESD65) page. 2. VDD slew rate must be less than 0.1V DC per 50ns for DLL lock retention. DLL lock time begins once VDD, VDDQ and input clock are stable. 3. If C, C are tied High, K, K become the references for C, C timing parameters. 4. To avoid bus contention, at a given voltage and temperature tCHQX1 is bigger than tCHQZ. The specs as shown do not imply bus contention because tCHQX1 is a MIN parameter that is worst case at 0C and 1.9V tCHQZ, is a MAX parameter that is worst case at 70C and 1.7V. 5. This parameter is guaranteed by device characterization, but not production tested. 6. All address inputs must meet the specified setup and hold times for all latching clock edges. 7. Control signals are R, W, BW0, BW1, BW2, BW3,E0, E1. 8. During production testing, the case temperature equals TA. 9. Clock High Time (tKHKL) and Clock Low Time (tKLKH) should be within 40% to 60%of the cycle time (tKHKH). 10. Clock to Clock time (tKHKH) and Clock to Clock time (tKHKH) should be within 45% to 55% of the cycle time (tKHKH).
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Timing Waveform for Alternating Read and Write Operations(1,2)
Read 0 Write 1 Read 2 Write 3 Read 4 Write 5 NOP 6 Write 7 NOP 8 NOP 9
K
tKHKL tKLKH tKHKH tKHKH tKHKH
K
R
tIVKH tKHIX
W
tAVKH tKHAX
A
A0
A1
A2
A3
A4
A5
A7
tAVKH tKHAX
tAVKH tKHAX
tIVKH
tKHIX
tIVKH
tKHIX
BWx(3) B10
B11
B30
B31
B50
B51
B70
B71
D
D10
D11
D30
D31
D50
tDVKH tKHDX
D51
D70
D71
tDVKH tKHDX
Q
tCHQX1
Q00(4)
Q01
Q20
tCQHQV
Q21
Q40
Q41
tCHQX tKLKH tCHQV tCHQV
tCHQX
tKHKH
tCHQZ
C
tKHKL tKHKH tKHKH
C
tCHCQV tCHCQX tCQHQV tCQHQX
CQ
tCHCQV tCHCQX tCQHQV tCQHQX
CQ
5677 drw 09
NOTES: 1. Device is selected per E[0] and E[1] as defined in Truth Table II, and MRST = VIH. 2. This waveform represents operation when DLL is ON. 3. To perform a valid write operation, both W and the appropriate BW0-3 must be low. 4. Q00 refers to the output from A0, and Q01 refers to the output from the next internal address following A0.
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Preliminary Datasheet Commercial Temperatue Range
Timing Waveform of Back-to-Back Read-Write-Read to Same Address(1,2)
NOTES: 1. Device is selected per E[0] and E[1] as defined in Truth Table II, and MRST = VIH. 2. This waveform represents operation when DLL is ON. 3. To perform a valid write operation, both W and the appropriate BW0-3 must be low. 4. ORIG Q00 represents the existing data in the memory. New Q00 represents the data written into the memory in the first cycle of the waveform.
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Preliminary Datasheet Commercial Temperatue Range
Timing Waveform for Left Port Write to Right Port Read(1)
0
1
2
3 tCO(2)
4
5
6
7
8
9
10
11
12
13
14
KL
tKHKH
KL
WL
Address_L
A0
A1
DINL
D00
D01
D10
D11
KR
KR
RR
Address_R
A0
A2
QR
tCHQX1
Q00
Q01
Q20
Q21
CR
tCHQV
CR
CQR CQR
5677 drw 11
NOTES: 1. Device is selected per E[0] and E[1] as defined inTruth Table III. MRST = VIH. BW0L, BW1L, BW2L, and BW3L = VIL 2. If tco < specified minimum, data read from right port is not valid until the next KR cycle. If tco > specified minimum, data read from right port is available on the first KR cycle as shown.
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Timing Waveforms for DLL Operation (On/Off)(1,2)
Read 0 Write 1 Read 2 Write 3 Read 4 Write 5 NOP 6 Write 7 NOP 8 NOP 9
K
tKHKL tKLKH tKHKH tKHKH tKHKH
K
R
tIVKH tKHIX
W
tAVKH tKHAX
A
A0
A1
A2
A3
A4
A5
A7
tAVKH tKHAX
tAVKH tKHAX
tIVKH
tKHIX
tIVKH
tKHIX
BWX(3)
B10
B11
B30
B31
B50
B51
B70
B71
D
D10
D11
D30
D31
D50
tDVKH tKHDX
D51
D70
D71
tCHQV
tDVKH tKHDX
tCHQZ
Case 1: Q DLL OFF (QDRI)(5)
tCHQX1
Q00(4)
tCHQX tCHQV
Q01
tCHQX
Q20
Q21
Q40
Q41
Case 2: Q DLL ON (QDRII)
tCHQX1
Q00(4)
Q01
Q20
Q21
Q40
Q41
tCHQX tKLKH tCHQV tCHQV
tCHQX tCHQZ tKHKH
C
tKHKL tKHKH tKHKH
C
5677 drw 12
NOTES: 1. Device is selected per E[0] and E[1] as defined in Truth Table II, and MRST = VIH. 2. With DLL OFF (DOFFX < VIL) device behaves as a QDRI device. With DLL ON (DOFFX > VIH) device behaves as a QDR-II device. 3. To perform a valid write operation, both W and the appropriate BW0-3 must be low on the rising edge of K. 4. Q00 refers to the output from A0, and Q01 refers to the output from the next internal address following A0. 5. With DLL off (DOFF = VIL) the propagation delays will be increased and the AC timing parameters will be different values from those specified in this data sheet.
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Preliminary Datasheet Commercial Temperatue Range
Master Reset Timing Waveform
K
MRST(1)
(5ns)
5677 drw13
NOTE: 1. MRST must be held LOW for a minimum of (5ns) after power supply is stable.
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Preliminary Datasheet Commercial Temperatue Range
IEEE 1149.1 Test Access Port and Boundary SCAN-JTAG
This part contains an IEEE standard 1149.1 Compatible Test Access Port (TAP). The package pads are monitored by the Serial Scan circuitry when in test mode. This is to support connectivity testing during manufacturing and system diagnostics. In conformance with IEEE 1149.1, the QDR-II Dual-Port Static RAM contains a TAP controller, Instruction Register, Bypass Register and ID Register. The TAP controller has a standard 16-state machine that resets internally upon power-up. It is possible to use this device without utilizing the TAP. To disable the TAP controller without interfacing with normal operation of the QDR-II Dual-Port Static RAM TCK must be tied to VSS to preclude a mid level input. TMS and TDI are designed so an undriven input will produce a response identical to the application of a logic 1, and may be left unconnected, but they may also be tied to Vdd through a resistor. TDO should be left unconnected.
JTAG Block Diagram
TAP Controller State Diagram
1 Test Logic Reset 0 Run Test Idle 1 Select DR 0 1 Capture DR 0 Shift DR 1 1 Exit 1 DR 0 Pause DR 1 Exit 2 DR 1 1 Update DR 0 1 1 Select IR 0 Capture IR 0 Shift IR 1 1 Exit 1 IR 0 Pause IR 1 Exit 2 IR 1 Update IR 1 0 1
0
0
0
0 0
0 0
5677 drw 15
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Identification Register Definitions
Instruction Field Revision Number (31:28) IDT Device ID (27:12) IDT JEDEC ID (11:1) ID Register Indicator Bit (Bit 0)
NOTE: 1. Device ID for IDT70P3517 is 0x356.
Value 0x0 0x355(1) 0x33 1 Reserved for version number
Description
Defines IDT part number (IDT70P3537) Allows unique identification of device vendor as IDT Indicates the presence of an ID register
5677 tbl 16
Scan Register Sizes
Register Name Instruction (IR) Bypass (BYR) Identification (IDR) Boundary Scan (BSR) Bit Size 4 1 32 Note 1
5677 tbl 17
NOTE: 1. The Boundary Scan Descriptive Language (BSDL) file for this device is available on the IDT website (www.idt.com), or by contacting your local IDT sales representative.
System Interface Parameters
Instruction EXTEST BYPASS IDCODE Code 0000 1111 0010 0100 Description Forces contents of the boundary scan cells onto the device outputs (1). Places the boundary scan register (BSR) between TDI and TDO. Places the bypass register (BYR) between TDI and TDO. Loads the ID register (IDR) with the vendor ID code and places the register between TDI and TDO. Places the bypass register (BYR) between TDI and TDO. Forces all device output drivers to a High-Z state except COLx & INTx outputs. Uses BYR. Forces contents of the boundary scan cells onto the device outputs. Places the bypass register (BYR) between TDI and TDO. Places the boundary scan register (BSR) between TDI and TDO. SAMPLE allows data from device inputs (2) to be captured in the boundary scan cells and shifted serially through TDO. PRELOAD allows data to be input serially into the boundary scan cells via the TDI. Several combinations are reserved. Do not use codes other than those identified above. For internal use only.
5677 tbl 18
HIGHZ CLAMP SAMPLE/PRELOAD
0011 0001
RESERVED PRIVATE
0101, 0111, 1000, 1001, 1010, 1011, 1100 0110,1110,1101
NOTES: 1. Device outputs = All device outputs except TDO. 2. Device inputs = All device inputs except TDI, TMS, and TRST.
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JTAG DC Operating Conditions
Parameter Power Supply Voltage (I/P + O/P) Input High Level Input Low Level Output High Voltage (IOH = -1mA) Output Low Voltage (IOL = 1mA) Symbol VDD VIH VIL VOH VOL Min 1.7 1.3 -0.3 VDD - 0.2 VSS Typ 1.8 Max 1.9 VDD+0.3 0.5 VDD 0.2 Unit V V V V V
5677 tbl 19
Note
JTAG AC Test Conditions
Parameter Input High/Low Level Input Rise/Fall Time Input and Output Timing Reference Level Symbol VIH/VIL TR/TF Value 1.8/0 1.0/1.0 VDD/2 Unit V ns V 1 Note
NOTE: 1. For outputs see AC test loads on page 10.
5677 tbl 20
JTAG AC Characteristics
Parameter TCK Cycle Time TCK High Pulse Width TCK Low Pulse Width TMS Input Setup Time TMS Input Hold Time TDI Input Setup Time TDI Input Hold Time Input Setup Time Input Hold Time Clock Low to Output Valid TRST Low to Reset JTAG TRST High to TCK HIGH Symbol tCHCH tCHCL tCLCH tMVCH tCHMX tDVCH tCHDX tSVCH tCHSX tCLQV tJRST tJRSR Min 100 40 40 10 10 10 10 10 10 0 50 50 Max 20 Unit ns ns ns ns ns ns ns ns ns ns ns ns
5677 tbl 21
Note
JTAG Timing Diagram
TCK TMS
tCHCH tMVCH tCHMX
tCHCL
tCLCH
tDVCH
tCHDX
TDI
tSVCH
tCHSX
Outputs
tCLQV
TDO TRST
tJRST tJRSR
5677 drw 16
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18/9Mb x36 IDT70P3537/70P3517 SYNCHRONOUS Dual QDR-IITM
Preliminary Datasheet Commercial Temperatue Range
Ordering Information
Preliminary Datasheet: Description
"PRELIMINARY" datasheets contain descriptions for products that are in early release.
Datasheet Document History
7/11/2007: Initial release of Preliminary Datasheet
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